Summary
- Morphotonics' extended Series B has closed above €40m after multiple financing tranches since 2024.
- The company plans to adapt its nanoimprint manufacturing technology for co-packaged data centre optics.
- Customers have validated the technology, but commercial data-centre equipment shipments have not yet been disclosed.
Morphotonics is expanding its nanoimprint manufacturing technology towards data centre photonics after closing an extended Series B financing round above €40 million.
The figure represents the completed size of a financing process assembled through several tranches since 2024 rather than more than €40 million of entirely new capital raised this week.
The Eindhoven-area company has built its business around large-area nanoimprint lithography equipment used to manufacture optical structures such as waveguides. It now plans to apply its process to photonic components for co-packaged optics.
Co-packaged optics is attracting growing attention as AI clusters increase the volume of data moving between accelerators, servers, switches, and racks. Electrical interconnects become harder to scale as speeds rise because signal integrity and power consumption worsen over distance.
Optical links can carry large volumes of data while reducing some of those electrical constraints. Co-packaged architectures move optical components closer to switch silicon, shortening the high-speed electrical path before data is converted to light.
Manufacturing those photonic structures at sufficient yield and volume is a separate challenge from designing the networking architecture itself. Morphotonics believes its nanoimprint approach can provide repeatable production across relatively large surfaces.
The company has said potential customers have validated the technology for data centre applications, but equipment specifically serving that market has not yet been reported as shipped commercially.
That distinction is important in a sector where new optical architectures are moving quickly from demonstration to qualification. Components entering hyperscale infrastructure must meet requirements around reliability, yield, cost, thermal performance, and interoperability before they are adopted at volume.
Morphotonics is expanding its established manufacturing platform at the same time. Management has outlined a new machine with capacity to manufacture more than six million waveguides a year, although that figure is an equipment-capacity target rather than evidence of equivalent customer demand.
The company has also expanded its workforce and installed a relatively small number of high-value systems globally. Hardware remains the majority of revenue, making successful equipment qualification and repeat orders more important than headline component volumes alone.
For data centre infrastructure, the opportunity lies in the optical supply chain forming around AI networking. GPUs receive most of the attention, but cluster scale is increasingly limited by the ability to move data between processors efficiently.
That is creating a market for optical engines, lasers, fibre, packaging, transimpedance amplifiers, drivers, and the manufacturing technologies required to produce them reliably.
The extended Series B gives Morphotonics more capital to pursue that market. Its progress will be clearer when customer validation is followed by a named production deployment or commercial equipment shipment.
