Cooling and HVAC
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The 246kW rack enters the design brief
Schneider Electric and AMD have published a validated infrastructure design for Helios clusters, including racks drawing up to 246kW and greenfield deployments reaching 10.4MW.
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Norway’s Drangedal campus grows by 40MW
Polar Data Centers has announced a second liquid-cooled facility at Drangedal, adding 40MW of planned IT capacity beside its operating DRA01 building.
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A €300m build takes shape at Kouvola
YIT will deliver design, civil works, MEP systems, and commissioning for a new building at atNorth’s planned 430MW FIN04 campus in Finland.
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Britain’s AI buildout meets peak water demand
Water UK has warned that rapid data centre growth could create peak water requirements far above average consumption, particularly in already stressed parts of eastern and south-eastern England.
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Heiligenhaus solar covers a sliver of data demand
Yexio has installed 244kWp of solar generation at its Heiligenhaus data centre, forecasting 220MWh a year against a facility capable of scaling from 2MW to 4MW.
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Liquid cooling orders double before standards settle
Georg Fischer says orders for data centre liquid-cooling systems doubled in the first half of 2026 as prefabricated polymer pipework, valves, controls, and instrumentation move into larger deployment programmes.
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Europe’s GPU deal still needs buildings and power
Microsoft will use part of Mistral’s expanding European GPU infrastructure under a multibillion-dollar agreement, although the campuses, electrical load, cooling systems, and delivery programme remain undisclosed.
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Dutch outage pulls power and cooling into one failure
A utility power failure in Google Cloud’s Dutch region developed into a cooling loss and protective workload shutdowns, disrupting bare-metal, VMware, and managed storage services for more than 12 hours.
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NFrance cools Toulouse without a drop
NFrance has completed a live cooling retrofit that it says cut cooling power by about 20%, removed operational water use, and protected hosted services throughout installation.
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The chip is becoming the cooling loop
TNO moves microfluidic cooling closer to AI chip heat sources.